Tri Linear Ceramic Content:
Ceramique2 uses only ceramic fillers so it is neither electrically conductive nor capacitive. The tri linear composite of aluminium oxide, zinc oxide and boron nitride allows the thinnest possible bond line with modern processors, heatsinks and electronics. Critically sized particles and new ultra high shear mixing techniques maximise Ceramique2s thermal performance and help maintain a stable homogenous suspension. This exclusive combination provides performance exceeding most metal based compounds.
Polysynthetic Suspension Fluid:
A new oil mixture, improved thermal filler properties and increased particle deagglomeration, dispersal and density enhance Ceramique2s thermal performance and overall stability. The third generation polysynthetic suspension fluid combines advanced synthetic oils to maximise wetting and stability while allowing a higher density of thermally conductive fillers.
Ceramique2 is engineered to not separate, run, migrate, or bleed.
Ceramique2 does not contain any metal or other electrically conductive materials. It is a pure electrical insulator, neither electrically conductive nor capacitive.
2 to 10 degrees centigrade lower CPU full load core temperatures than standard thermal compounds or thermal pads when measured with a calibrated thermal diode imbedded in the CPU core.
The amount of compound remaining in the 2.7 gram syringe is easy to determine as the rear of the plunger is perfectly flush with the flange when the syringe is empty.
Easy Clean Up:
Ceramique2 can easily be cleaned from CPUs and heatsinks with ArctiClean, isopropyl alcohol or any of the cleaners listed in the product guide.
Average Particle Size:
<0.36 microns <0.000015 inch (70 particles lined up in a row equal 1/1000th of an inch.)
Peak: ?150?C to >185?C
Long-Term: ?150?C to 130?C
2.7gram syringe (Approximately 1cc).
At a layer 0.003" thick, one tube will cover about 22 square inches.
Due to the unique shapes and sizes of the particles in Ceramique2, it will take a minimum of 25 hours and several thermal cycles to achieve maximum particle to particle thermal conduction and for the heatsink to CPU interface to reach maximum conductivity.